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* Proceedings template



Important dates:


Round II

  Submission:   September 15 , 2017  

  Notification:  September 25, 2017

  Registration: October 5,, 2017


Round I

  Submission:   July 31, 2017  

  Notification:   August 15, 2017

  Registration:   August 25, 2017












The 5th International Conference on Advanced Materials and


Engineering Applications (AMEA 2017)


29-30 December 2017, Hong Kong





International Conference on Advanced Materials and Engineering Applications (AMEA) aims to bring together academic scientists, leading engineers, industry researchers and scholar students to exchange and share their experiences and research results about all aspects of advanced materials and their engineering applications, and discuss the practical challenges encountered and the solutions adopted

   In 2017, AMEA will be held in Hong Kong, 29-30 December 2017.  All AMEA 2017 papers will be published in Journal of materials and applications (JMA, ISSN: 2051-7742). You are invited to submit papers in all areas of advanced materials and their applications.


1.The list of topics includes (but is not limited to) : 

    -- Material Science
    -- Metal materials and applications
    -- Non-metallic materials and applications

    -- Building Materials and applications

    -- Chemical materialsand engineering
    -- Composite materials and applications
    -- Electronic / magnetic / optical materials and applications
    -- Electrician / Electrical Materials and applications
    -- Biological materials and applications

    -- Other materials and applications


2. Paper submission
    Manuscripts should be written in English. All papers should be more than 6 pages in length. Whenever applicable, submissions must include the following elements: title, authors, affiliations, abstract, keywords, introduction, main text, conclusions and references.
    Author should format their paper according to template. Submission implies the willingness of at least one of the authors to register the work. 
    * Only formatted papers could be accepted. To download the templete file, please click here.


You could submit your paper to:


3. Registration fees 
     Normal Author Fees: Free of charge 

4. Contact
    If you have any question, please feel free to contact us at: